The thermal analysis was conducted using a combination of computational fluid dynamics (CFD) simulations and experimental measurements. The CFD simulations were performed using ANSYS Fluent software, while the experimental measurements were taken using thermocouples and infrared thermography.

| | Measured Temperature (°C) | Simulated Temperature (°C) | | --- | --- | --- | | Elevated Temperature (50°C) | 73.1 | 71.2 |

The results of the thermal analysis indicate that the FSDSS232 operates within a safe temperature range under various operating conditions. However, the results also show that the component temperature increases significantly under high power operation and elevated ambient temperatures.

The FSDSS232, a high-performance component, has been subject to thermal analysis to assess its heat dissipation characteristics. This report presents the findings of the investigation into the thermal behavior of the FSDSS232 under various operating conditions.

The results show that the FSDSS232 operates at a higher temperature at elevated ambient temperatures, with a measured temperature of 73.1°C and a simulated temperature of 71.2°C. The FSDSS232 was also tested under high power operation (20W) at room temperature (23°C). The results are presented below:

| | Measured Temperature (°C) | Simulated Temperature (°C) | | --- | --- | --- | | Room Temperature (23°C) | 45.2 | 43.5 |